POLISHING PASTE Micro Cut M2.02, 1 L

Koch-Chemie Micro Cut (M2.02) is a next-generation anti-hologram finishing polish with low cutting performance and a high gloss level (Koch-Chemie rating: CUT 2.5 / GLOSS 9.0).

It mechanically removes holograms, polishing haze, very fine scratches and P4000 or finer sanding marks rather than simply concealing them, making it suitable for correcting the finest defects remaining after previous polishing stages.

The silicone-oil-free formula does not provide a protective or sealing effect. It is suitable for all types of automotive paintwork, including scratch-resistant clear coats, and produces a particularly refined, high-gloss finish on dark and sensitive paint colours.

Advantages:

— Recommended for powerful dual-action (DA) polishing machines with a 15 mm or greater throw, as well as forced-rotation machines

— Economical in use: 4–5 drops are sufficient for one working section

— Easy to wipe off without streaks or residue

— Koch-Chemie cut and gloss rating: CUT 2.5 / GLOSS 9.0

— Original Koch-Chemie product

Areas of application:

— Holograms and polishing haze remaining after previous correction stages

— Very fine scratches and P4000 or finer sanding marks

— Final refinement of dark and sensitive paint finishes to achieve a high level of gloss

— Final stage of multi-step paint correction

Directions for use:

Apply 4–5 drops of the polish to a Micro Cut Pad. Spread the product evenly over the working area at the machine’s lowest speed setting.

Then polish using overlapping cross-hatch passes with moderate pressure until the polish becomes nearly transparent, indicating that the product has been fully worked.

Remove any remaining residue with a clean microfiber towel.

Do not use a pad that has been used with this product for other polishing compounds. Do not apply to painted plastic or rubber components.

Suitable for professional use and experienced private users